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datashee t product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays 1/21 tsz22111 ~ 14 ~ 001 ? 2013 rohm co., ltd. all rights reserved. tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 www.rohm.com 1 channel compact high side switch ics 2.0a current limit high side switch ics bd82022fvj description bd82022fvj is a single channel high side switch ic employing n-channel power mosfet with low on resistance and low supply current for the power supply line of universal serial bus (usb). this ic has a built-in over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start circuits. features ? over-current protection 2.0a ? control input logic active-high ? output discharge function ? reverse current protection when power switch off ? thermal shutdown ? open-drain fault flag output ? under-voltage lockout ? ocp fast response ? soft-start circuit ? esd protection ? ul file no. e243261 ? iec 60950-1 cb_scheme: file no.us-18106-ul applications usb hub in consumer appliances, pc, pc peripheral equipment, and so forth key specifications ? input voltage range: 2.8v to 5.5v ? on resistance: (v in =5v) 90m ? (typ) ? over current threshold: 2.0a ? standby current: 0.01a (typ) ? operating temperature range: -40 ? to +85 ? package w(typ) d(typ) h(max) tssop-b8j 3.00mm x 4.90mm x 1.10mm typical application circuit figure 1. typical application circuit tssop-b8j ( msop8 jedec ) ou t ou t ou t inin /oc gn d 5 v(typ.) c l c i n - + en(/en) 3.3v 10k ? ~ 100k ? v out 10k ? to 100k ? 5v(typ) downloaded from: http:///
2/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 block diagram pin configuration pin descriptions pin no. symbol i/o function 1 gnd - ground 2, 3 in i power supply input input terminal to the power switch and power s upply input terminal of the internal circuit short these pins externally 4 en, /en i enable input active high power on switch high level input > 2.0v, low level input < 0.8v 5 /oc o error flag output low when over-current or thermal shutdown is activated open drain output 6, 7, 8 out o power switch output short these pins externally figure 2. block diagram uvlo in gnd charge pump gate logic ocd tsd in en(/en) out out out /oc figure 3. pin configuration (top view) 1 2 3 4 8 7 6 5 gnd inin /oc out out out top view en(/en) downloaded from: http:///
3/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 absolute maximum ratings (ta=25 ? ) parameter symbol rating unit in supply voltage v in -0.3 to +6.0 v en input voltage v en -0.3 to +6.0 v /oc voltage v /oc -0.3 to +6.0 v /oc sink current i /oc 5 ma out voltage v out -0.3 to +6.0 v storage temperature tstg -55 to +150 ? power dissipation pd 587.5 (1) mw (1) mounted on 70mm x 70mm x 1.6mm glass epoxy board. reduce 4.7mw per 1 ? above 25 ? recommended operating ratings parameter symbol rating unit min typ max in operating voltage v in 2.8 - 5.5 v operating temperature topr -40 - +85 ? electrical characteristics (v in = 5v, ta= 25 ? , unless otherwise specified.) dc characteristics parameter symbol limit unit condition min typ max operating current i dd - 95 135 a v en = 5v, v out = open standby current i stb - 0.01 1 a v en = 0v, v out = open en input voltage v enh 2.0 - - v high input v enl - - 0.8 v low input en input leakage i en -1 0.01 +1 a v en = 0v or 5v on resistance r on - 90 115 m ? i out = 1.0a reverse leak current i rev - - 1 a v out = 5.5v, v in = 0v over-current threshold i th 1.5 2.0 2.6 a current load slew rate 100a/s short circuit output current i sc 1.1 1.4 1.9 a v out =0v c l =100f rms output discharge resistance r disc 75 150 ? i out = 1ma, v en = 0v /oc output low voltage v /oc - - 0.4 v i /oc = 1ma /oc output leak current il /oc - 0.01 1 a v /oc = 5v uvlo threshold v tuvh 2.0 2.3 2.5 v v in increasing v tuvl 1.9 2.2 2.4 v v in decreasing ac characteristics parameter symbol limit unit condition min typ max output rise time t on1 0.4 10 ms rl=10 ? output turn-on time t on2 - 0.6 20 ms output fall time t off1 - 2 20 s output turn-off time t off2 - 4 40 s /oc delay time t /oc 5 12 20 ms downloaded from: http:///
4/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 measurement circuit gnd in in en(/en) out outout /oc v en (v /en ) 1f v in a gnd in in en(/en) out outout /oc v en (v /en ) 1f r l v in 10k ? v in a operating current en, input vo ltage, output rise/fall time gnd in in en(/en) out out out /oc v en (v /en ) 1f 10k ? c l v in v in i out a t 10 f gnd in in en(/en) out outout /oc v en (v /en ) 1f v in a i /oc on resistance, over-current protection t use capacitance of more than 10uf at output short test by using external supply. /oc output low voltage figure 4. measurement circuit timing diagram t on1 v out 10% 90% 90% t off1 t on2 v en 50% t off2 50% 10% figure 5. output rise/fall time downloaded from: http:///
5/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 typical performance curves 0.0 0.2 0.4 0.6 0.8 1.0 23456 figure 8. standby current en disable standby current : i stb [ a] ta=25c supply voltage : v in [v] 0.0 0.2 0.4 0.6 0.8 1.0 - 5 005 01 0 0 ambient temperature ; ta[c] standby current : i stb [ a] figure 9. standby current en disable v in =5.0v 0 20 40 60 80 100 120 140 - 5 005 01 0 0 operating current : i dd [ a] ambient temperature ; ta[c] figure 7. operating current en enable v in =5.0v figure 6. operating current en enable 0 20 40 60 80 100 120 140 23456 operating current : i dd [ a] supply voltage : v in [v] ta=25c downloaded from: http:///
6/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 typical performance curves - continued figure 10. en input voltage 0.0 0.5 1.0 1.5 2.0 23456 supply voltage : v in [v] enable input voltage : v en [v] ta=25c low to high high to lo w enable input voltage : v en [v] 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 ambient temperature ; ta[c] figure 11. en input voltage v in =5.0v low to high high to lo w 0 50 100 150 200 23456 supply voltage : v in [v] on resistance : r on [m ? ] figure 12. on resistance ta=25c on resistance : r on [m ? ] 0 50 100 150 200 -50 0 50 100 ambient temperature ; ta[c] figure 13. on resistance v in =5.0v downloaded from: http:///
7/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 typical performance curves - continued figure 16. /oc output low voltage 0 20 40 60 80 100 23456 supply voltage : v in [v] /oc output low voltage : v /oc [mv] ta=25c 0 20 40 60 80 100 - 5 005 01 0 0 ambient temperature ; ta [ c ] /oc output low voltage : v /oc [mv] figure 17. /oc output low voltage v in =5.0v 1.0 1.5 2.0 2.5 3.0 23456 supply voltage : v in [v] over current threshold : i th [a} figure 14. over-current threshold ta=25c 1.0 1.5 2.0 2.5 3.0 -50 0 50 100 over current threshold : i th [a} v in =5.0v figure 15. over-current threshold ambient temperature ; ta[c] downloaded from: http:///
8/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 typical performance curves - continued 2.0 2.1 2.2 2.3 2.4 2.5 - 5 005 01 0 0 ambient temperature ; ta[c] figure 18. uvlo threshold uvlo threshold : vt uvl [v] v tuvh v tuvl ta=25c 0.0 0.2 0.4 0.6 0.8 1.0 - 5 005 01 0 0 ambient temperature ; ta[c] figure 19. uvlo hysteresis voltage v in =5.0v uvlo hysteresis voltage : v hys [v] 0.0 1.0 2.0 3.0 4.0 5.0 23456 supply voltage : v in [v] rise time : t on1 [ms] figure 20. output rise time ta=25c 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature ; ta[c] rise time : t on1 [ms] figure 21. output rise time v in =5.0v downloaded from: http:///
9/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 typical performance curves - continued 0.0 1.0 2.0 3.0 4.0 5.0 23456 supply voltage : v in [v] turn on time : t on2 [ms] figure 22. output turn-on time ta=25c 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature ; ta[c] turn on time : t on2 [ms] figure 23. output turn-on time v in =5.0v supply voltage : v in [v] fall time : t off1 [ s] 0.0 1.0 2.0 3.0 4.0 5.0 23456 figure 24. output fall time ta=25c 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature ; ta[c] fall time : t off1 [ s] figure 25. output fall time v in =5.0v downloaded from: http:///
10/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 typical performance curves - continued 0.0 2.0 4.0 6.0 8.0 10.0 23456 supply voltage : v in [v] turn-off time : t off2 [ s] figure 26. output turn-off time ta=25c figure 27. output turn-off time 0.0 2.0 4.0 6.0 8.0 10.0 - 5 005 01 0 0 ambient temperature ; ta[c] turn-off time : t off2 [ s] v in =5.0v 5 10 15 20 -50 0 50 100 ambient temperature ; ta[c] /oc delay time : t /oc [ms] figure 29. /oc delay time v in =5.0v 10 12 14 16 18 20 23456 figure 28. /oc delay time supply voltage : v in [v] /oc delay time : t /oc [ms] ta=25c downloaded from: http:///
11/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 typical performance curves - continued 0 50 100 150 200 23456 supply voltage : v in [v] disc on resistance: r disc [ ? ] figure 30. discharge on resistance ta=25c 0 50 100 150 200 - 5 005 01 0 0 ambient temperature ; ta[c] disc on resistance: r disc [ ? ] figure 31. discharge on resistance v in =5.0v downloaded from: http:///
12/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 typical wave forms bd82022fvj time(1ms/div.) figure 32. output rise characteristic v en (5v/div.) v in =5v r l =10 ? v /oc (5v/div.) v out (5v/div.) i in (1.0a/div.) time(1s/div.) figure 33. output fall characteristic v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i in (1.0a /div.) v in =5v r l =10 ? time(5ms/div.) figure 35. over-current response ramped load v /oc (5v/div.) v out (5v/div.) i in (1.0a/div.) v in =5v c l =100f v in =5v r l =10 ? time(1ms/div.) figure 34. inrush current response v en (5v/div.) v /oc (5v/div.) i in (0.5a/div.) c l =47 f c l =100 f c l =220 f downloaded from: http:///
13/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 typical wave forms bd82022fvj time(10ms/div.) figure 38. uvlo response increasing v in v in (5v/div.) i in (0.5a/div.) v out (5v/div.) r l =10 ? time(10ms/div.) figure 39. uvlo response decreasing v in v in (5v/div.) i in (0.5a/div.) v out (5v/div.) r l =10 ? time(20ms/div.) figure 36. over-current response enable to shortcircuit v in =5v i in (1.0a/div.) v en (5v/div.) v /oc (5v/div.) v out (5v/div.) time(5ms/div.) figure 37. over-current response 1
load connected at enable v in =5v i in (1.0a/div.) v /oc (5v/div.) v out (5v/div.) downloaded from: http:///
14/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 typical application circuit in ou t regulator ou t ou t ou t inin / o c gn d vbu s d- d+ gn d us b controlle r 5v(typ.) 10 k ? to 100k ? c l c in - + en ( / en ) figure 40. typical application circuit application information when excessive current flows due to output short-circuit or overload ringing occurs because of inductance between power source line and ic. this may cause bad effects on ic operations. in order to avoid this case, connect a bypass capacitor c in across in terminal and gnd terminal of ic. 1f or higher is recommended. in order to decrease voltage fluctuations of power source line to ic, connect a low esr capacitor in parallel with c in. 10f to 100f or higher is recommended. pull up /oc output via resistance value of 10k ? to 100k ? . set up a value for c l which satisfies the application. this system connection diagram does not guaran tee operation as the intended application. when using the circuit with changes to the external circuit values, make sure to leave an adequate margin for external components including static and transitional characteristics as well as the design tolerances of the ic. functional description 1. switch operation in terminal and out terminal are connected to the drain and t he source of switch mosfet respectively. the in terminal is also used as power source input to internal control circuit. when the switch is turned on from en control input, the in terminal and out terminal are connected by a 90m ? (typ) switch. in on status, the switch is bidirectional. therefore, when the potential of out terminal is higher than that of the i n terminal, current flows from out terminal to in terminal. since the parasitic diode between the drain and the source of switch mosfet is canceled current flow from out to in is prevented during off state. 2. thermal shutdown circuit (tsd) if over current would continue, the temperature of the ic w ould increase drastically. if the junction temperature reaches beyond 130 ? (typ) during the condition of over current detection, thermal shutdown circuit operates and turns power switch off and outputs an error flag (/oc). then, when the junction temperature decreases below 120 ? (typ), power switch is turned on and error flag (/oc) is cancelled. unless the cause of the increase of the chips temperature is removed or the output of power switch is turned off, this operation repeats. the thermal shutdown circuit operates when the switch is on (en signal is active). 3. over-current detection (ocd) the over-current detection circuit (ocd) limits current (i sc ) and outputs error flag (/oc) when current flowing in each switch mosfet exceeds a specified value. there are three cases when the ocd circuit is activated. the ocd operates when the switch is on (en signal is active). downloaded from: http:///
15/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 (1) when the switch is turned on while the output is in short-circuit status, the switch gets in current limit status immediately. (2) when the output short-circuits or when high current load is connected while the switch is on, very large current will flow until the over-current limit circuit reacts. when this happens, the over-current limit circuit is activated and the current limitation is carried out. (3) when the output current increases gradually, current limitation does not work until the output current exceeds the over-current detection value. when it exceeds the detection value, current limitation is carried out. 4. under-voltage lockout (uvlo) uvlo circuit prevents the switch from turning on until v in exceeds 2.3v(typ). if v in drops below 2.2v(typ) while the switch is still on, then the uvlo wi ll shut off the power switch. uvlo has a hysteresis of 100mv(typ). under-voltage lockout circuit works when the switch is on (en signal is active). 5. error flag (/oc) output error flag output is an n-mos open drain output. upon detection of over current or thermal shutdown, the output level becomes low. over-current detection has a delay filter. this delay filt er prevents current detection flags from being sent during instantaneous events such as surge current due to switching or hot plug. figure 41. over-current detection, thermal shutdown timing v en v out i out v /oc out p ut shortcircuit thermal shut down dela y downloaded from: http:///
16/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 power dissipation the power dissipation depends on output load, ambient temperature and pcb layout. the devices have current capacity of 1.5a respectively. power dissipation can be calculated using the output current and the r on of the power switch as below. pd = r on x i out 2 the derating curve is shown below tssop-b8j (msop-8 jedec standard) 0 200 400 600 800 1000 1200 0 25 50 75 100 125 150 ambient temperature ; ta[c] power dissi p ation : p d [ mw ] 962m w 758m w 587.5m w 4 layer board mounting 2 layer board mounting 1 layer board mounting note: ic is mounted on 70mmx70mmx1.6mm glass-epoxy pcb. derating is 4.7mw/ ? above ta=25 ? . figure 42. power dissipation curve (pd-ta curve) downloaded from: http:///
17/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 i/o equivalent circuit symbol pin no. equivalent circuit en(/en) 4 en (/en) /oc 5 /oc out 6,7,8 out operational notes 1. absolute maximum ratings operating the ic over the absolute maximum ratings may dam age the ic. in addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. therefore, it is important to consider circuit protection measures, like adding a fuse, in case the ic is operated in a special mode exceeding the absolute maximum ratings. 2. operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 3. reverse connection of power supply connector connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics pow er supply terminals. 4. power supply line design the pcb layout pattern to provide low impedance ground and supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at a ll power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 5. gnd voltage the voltage of the ground pin must be the lowest voltage of all pins of the ic at all operating conditions. ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 6. short circuit between terminals and erroneous mounting ensure that when mounting the ic on the pcb the direction and position are correct. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 7. operation in strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. downloaded from: http:///
18/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 8. inspection with set pcb when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from electro static discharge, ground the ic during assembly and use similar precautions during transport and storage. 9. input terminals in the construction of this ic, p-n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the gnd voltage should be avoided. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input terminals have voltages within the values specified in the electrical characteristics of this ic.. 10. ground wiring pattern when using both small-signal and large-current gnd traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the gnd traces of external components do not cause variations on the gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. 11. external capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 12. thermal shutdown circuit (tsd) the ic incorporates a built-in thermal shutdown circuit, which is designed to turn off the ic when the internal temperature of the ic reaches a specified value. do not conti nue to operate the ic after this function is activated. do not use the ic in conditions where this function will always be activated. 13. thermal design use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. downloaded from: http:///
19/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 ordering information b d 8 2 0 2 2 f v j - e 2 part no. part no. package fvj : tssop-b8j (msop-8 jedec) packaging and forming specification e2: embossed tape and reel lineup over-current threshold control logic part number 2.0a active- high bd82022fvj marking diagram part number marking bd82022fvj 022 tssop-b8j(top view) part number marking lot number 1pin mark d82 downloaded from: http:///
20/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 physical dimension, tape and reel information package name tssop-b8j direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () 1pin downloaded from: http:///
21/21 datasheet datasheet bd82022fvj ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ~ 15 ~ 001 tsz02201-0e3e0h300470-1-2 18.sep.2013 rev.002 revision history date revision changes 2.apr.2013 001 new release 18.sep.2013 002 revised derating of power dissipation downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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